MATERIALS WE MACHINE

Bullen machines a variety of hard, brittle materials including glass, silicon, silicon carbide, ceramic matrix composites, sapphire, and many more.

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ULTRASONIC MACHINING

Ultrasonic machining is a low material removal rate (MRR), loose abrasive machining process in which the mirror image of a shaped tool can be created in hard, brittle materials. Material removal is achieved by the direct and indirect hammering of abrasive particles against a workpiece by means of an ultrasonically vibrating tool.

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ENGINEERING SUPPORT

Through a dedication to customer requirements and a commitment to continually develop solutions to technology challenges in hard, brittle materials, Bullen has established itself as a technology partner of many the world’s leading industrial firms.

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QUESTIONS? CALL US AT 937-456-7133

  • Aerospace CMC's

    Bullen machines CMC’s for defense and aerospace clients involved in high-reliability applications.

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  • MEMS Technical Glass

    Microelectromechanical (MEMS) and microsystem developers worldwide trust Bullen to provide high-performance MEMS glass wafers and substrates for their prototype and production processing.

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  • Customized Industry Solutions

    Bullen machines a wide variety of materials for various clients involved in high-reliability applications.

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  • Semiconductor Ceramics

    Semiconductor equipment manufacturers, fabricators and ceramic material manufacturers rely on Bullen for precision machining of critical components for semiconductor process equipment.

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