MEMS Technical Glass
Microelectromechanical (MEMS) and microsystem developers worldwide trust Bullen to provide high-performance MEMS glass wafers and substrates for their prototype and production processing.
ISO 9001 Certified
AS9100 Certified
IATF 16949 Compliant
ITAR Registered
You’ve perfected the design – don’t compromise it.
Considering Traditional Machining for your MEMS Production?
Know what you’re getting Into:
Conventional Machining
(LASER/EDM)
Limited Number and Selection of Features, Shapes, and Sizes
Time-Consuming Process
Potential Heat-Affected and Subsurface Damage
Possible Negative Impact End-Use
BULLEN ULTRASONIC MACHINING
Lower Net Cost
Higher Production Yield
No Post-Processing Steps Required
Greater Design Reliability & Quality
More Feature Sizes Possible
bullen technical glass capabilities
✓ ULTRASONICALLY HIGH ASPECT RATIO PRECISION FEATURES IN 300 MM DIAMETER COMPONENTS
✓ Tapered or straight-walled round, square, and odd-shaped vias and cavities
APPLICATIONS
Bullen structured glass wafers and substrates are used in a wide range of MEMS applications, including:
Pressure Sensors
Inertial Measurement Units
DNA Analysis
Implantable Sensors
you deserve a better option
We’ll work with you to determine which non-traditional process is right for your design.
ULTRASONIC MACHINING
The world’s leading Ultrasonic Machining company, Bullen provides a superior solution to traditional machining when your design requires a feature or pattern in certain hard, brittle, & specialty materials.
Explore Ultrasonic Machining >
MICROLUCENT® MACHINING
Bullen uses unique laser technology to cut precise features in transparent materials. This proprietary technology lowers costs while improving the quality of cuts.
Explore Microlucent® Machining >
Bullen glass wafers set the standard for quality and precision, allowing you to focus on your process and design rather than your supplier parts’ quality.
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