Ceramic Substrates


If you haven’t considered ultrasonic machining for your thin and thick film ceramic substrate designs, you may be missing out on an opportunity to:

  • Reduce your total solution cost
  • Improve your production yields
  • Eliminate post-processing steps
  • Increase the reliability of your designs.

Bullen machines ceramic substrates for defense and aerospace clients involved in high-reliability telecommunication applications. For this and other critical applications, customers count on Bullen for precision-machined ceramic substrates.

Ultrasonic machining offers many advantages over conventional laser machining of ceramic substrates.


  • Lower Total Cost/Higher Yield
  • Non-thermal, low-MRR process creates no HAZ, and little or no subsurface damage. As a result, no post-machining polishing or annealing processes are required to relieve residual stress and slag caused by laser machining
  • With Bullen’s unique ultrasonic machining technology, the chemical and physical properties of your substrate material remain unchanged, increasing reliability
  • Features sizes not possible with laser machining on thicker substrates are possible with precision ceramic machining from Bullen
  • Machined features have straight side walls and don’t exhibit hole roll-off that is customary with laser machining resulting in higher feature densities on your thin or thick film ceramic substrates

SEM of a 0.64 mm hole ultrasonically machined in an alumina substrate


  • Alumina substrates
  • AlN substrates
  • SiC substrates
  • Fused silica substrates
  • Thin film ceramic substrates
  • Thick film ceramic substrates


  • Machined slots
  • Round, square, and odd-shaped thru-holes and cavities