| Process | Definition | Application |
|---|---|---|
| Ultrasonic Machining | Ultrasonic machining is a low material removal rate (MRR), loose abrasive machining process in which the mirror image of a shaped tool can be created in hard, brittle materials. | Ultrasonic machining is suitable for machining of hard, brittle materials including: -Glass -Sapphire -Alumina -Ferrite -PCD -Piezoceramics -Quartz -CVD Silicon Carbide -Ceramic Matrix Composites -Technical Ceramics |
| Semiconductor Ceramics | Semiconductor equipment manufacturers, fabricators and ceramic material manufacturers rely on Bullen for precision machining of critical components for semiconductor process equipment. | Part types typically machined include: -Gas distribution plates, showerheads (electrodes) -Wafer chucks -Wafer carriers |
| MEMS Technical Glass | Microelectromechanical (MEMS) and microsystem developers worldwide trust Bullen to provide high-performance MEMS glass wafers and substrates for their prototype and production processing. | Bullen MEMS glass wafers exhibit: -High-quality surface finish, with little or no subsurface damage, providing superior anodic bonding performance -Tapered or straight-walled round, square, and odd-shaped vias and cavities -Precision tolerances |
| Aerospace Ceramic Matrix Composites | Ultrasonic machining for your ceramic matrix composite (CMC) designs. | Ultrasonic machining offers many advantages over conventional laser and EDM machining of ceramic matrix composites. -Reduces total solution cost -Improves production yields -Eliminate post-processing steps -Increase the reliability of designs |