Polished Glass Substrates


Bullen single and double-sided polished glass wafers set the standard for quality for your MEMS and optoelectronic applications.
Bullen glass wafers exhibit:
  • Surface finish Ra< 15A and TTV < 9 microns

  • Minimal to no sub-surface damage means premium performance for anodic bonding applications and post-polish etching processes

  • Superior flatness and parallelism

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Material Sizes Edge Finish Cleaning/Packaging Options
Pyrex®, Schott Borofloat®, Hoya SD-2, Fused Silica and Quartz 2.0″to 8.0″, 50.8 mm to 200 mm, and thicknesses >0.350 mm Ground edge with safety bevel Ultrasonic cleaning in coin-style packaging is standard (slotted wafer containers available upon request) Clean room packaging, semi-standard notches and flats available

For expedited delivery, we maintain an inventory of standard wafer sizes 4″(100 mm), 6″(150 mm), and 8″(200 mm) in thicknesses of 0.5 mm, 0.7 mm, and 1.0 mm. Non-standard glass substrates, including square and rectangular, can be custom fabricated.