Semiconductor equipment manufacturers, fabricators and ceramic material manufacturers rely on Bullen for precision machining of critical components for semiconductor process equipment.
Our extensive knowledge in the machining of glass and ceramics, combined with unique ultrasonic machining capabilities, enable Bullen to provide custom, high-quality, cost-effective solutions meeting the strict requirements of the semiconductor industry.
Bullen is capable of machining high aspect ratio precision features in 300 mm diameter components¬ in a wide range of semiconductor materials, including CVD Silicon Carbide, Alumina, Sapphire, Aluminum Nitride, Silicon, Silicon Nitride, Yttria and many others.
Part types machined include:
Typical machining processes include:
Advantages to working with Bullen: