Polished Glass Substrates

Bullen single- and double-sided polished glass wafers set the standard for quality for your MEMS and optoelectronic applications. 

Bullen glass wafers exhibit:

• Surface finish Ra< 15A and TTV < 9 microns
• Minimal to no sub-surface damage means premium performance for anodic bonding applications and post-polish etching processes
• Superior flatness and parallelism

Material: Pyrex®, Schott Borofloat®, Hoya SD-2, Fused Silica and Quartz

Sizes: 2.0”to 8.0”, 50.8 mm to 200 mm, and thicknesses >0.350 mm

Edge Finish: Ground edge with safety bevel

Cleaning/Packaging: Ultrasonic cleaning in coin-style packaging is standard (slotted wafer containers available upon request).

Options: Clean room packaging, semi-standard notches and flats available.

For expedited delivery, we maintain an inventory of standard wafer sizes 4”(100 mm), 6”(150 mm), and 8”(200 mm) in thicknesses of 0.5 mm, 0.7 mm, and 1.0 mm. Non-standard glass substrates, including square and rectangular, can be custom fabricated.

Learn more about Bullen’s structured wafer capabilities, or click here to speak to a member of our technical team.