Customized Industry Solutions

BEN_3706

If you haven’t considered ultrasonic machining for your unique design, you may be missing out on an opportunity to:

  • Significantly reduce your total solution cost
  • Improve your production yields
  • Eliminate post-processing steps
  • Increase the reliability of your designs.

Bullen machines a wide variety of materials for defense, aerospace, semiconductor, automotive, medical, and various other clients involved in high-reliability applications. For this and other critical applications, customers count on Bullen for precision-machined materials.

Ultrasonic machining offers many advantages over conventional laser machining of ceramic substrates.

Advantages:

  • Lower Total Cost/Higher Yield
  • Non-thermal, process creates no HAZ, and little or no subsurface damage. As a result, no post-machining polishing or annealing processes are required to relieve residual stress and slag caused by laser machining
  • With Bullen’s unique ultrasonic machining technology, the chemical and physical properties of your substrate material remain unchanged, increasing reliability
  • Features sizes not possible with laser machining on thicker substrates are possible with precision ceramic machining from Bullen
  • Machined features have straight side walls and don’t exhibit hole roll-off that is customary with laser machining resulting in higher feature densities on your thin or thick 1m film ceramic substrates
littlehole

SEM of a 0.64 mm hole ultrasonically machined in an alumina substrate

Materials:

  • Alumina
  • AlN
  • SiC
  • Fused silica
  • Glass
  • Silicon
  • Sapphire
  • Synthetic diamond
  • Exotic ceramics
  • CMC’s
  • Thin 1m ceramic substrates
  • Thick 1m ceramic substrates

Capabilities:

  • Machined slots
  • Round, square, and odd-shaped thru-holes and cavities