Bullen can help with your dicing and singulation needs by using precise dicing saws.

State of the art, automated, dicing saws enable micron-level accuracies on your parts. We use precision diamond saw blades to cut a variety of hard and brittle materials.

  • Wafer dimensions up to 6″ diameter or a 6″ x 6″ substrate in glass, sapphire, ceramics and other hard brittle materials
  • The cut width can be as small as 50 microns and the cut depth down to few microns across the entire wafer
  • Cut depth uniformity and control can be maintained by our dicing saw and with optimal process conditions
  • Vision-based alignment methods allow dicing to be done with extreme precision to any pre-existing metal or etched patterns/features on the work-piece